Pad assembly for electrochemical mechanical processing
US7344431B2 · kind B2 · utility
5Cited by
220References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2006 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Jul 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.