Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7344755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2003 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Aug 21, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4404
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides methods and apparatus that may be used to process microfeature workpieces, e.g., semiconductor wafers. Some aspects have particular utility in depositing TiN in a batch process. One implementation involves pretreating a surface of a process chamber by contemporaneously introducing first and second pretreatment precursors (e.g., TiCl4 and NH3) to deposit a pretreatment material on a the chamber surface. After the pretreatment, the first microfeature workpiece may be placed in the chamber and TiN may be deposited on the microfeature workpiece by alternately introducing quantities of first and second deposition precursors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.