Patent · US Expired

Integrated circuit device having reduced bow and method for making same

US7344921B2 · kind B2 · utility

0Cited by

33References

20Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

William Tandy · Boise, US
Matt E. Schwab · Boise, US
Cary J. Baerlocher · Meridian, US

Key dates

Filing date	Feb 21, 2006
Grant date	Mar 18, 2008
Priority date	—
Expiry date	May 12, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.