Method of providing printed circuit board with conductive holes and board resulting therefrom
US7348677B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2006 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Aug 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.