Reducing polishing pad deformation
US7354334B1 · kind B1 · utility
4Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2005 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Jun 22, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A vent path is provided with an opening to the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.