Chuck with integrated wafer support
US7362115B2 · kind B2 · utility
14Cited by
746References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2007 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Jan 19, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.