Method of mounting an integrated circuit package in an encapsulant cavity
US7364945B2 · kind B2 · utility
57Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2006 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | May 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.