Process chamber component having electroplated yttrium containing coating
US7371467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2004 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Sep 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12806
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating is resistant to corrosion in the plasma, and can have a compositional gradient of yttrium-containing species through a thickness of the coating. In one embodiment, the coating is formed by electroplating a layer comprising yttrium onto the surface, and then electroplating a second layer onto the first layer, and annealing the first and second layers. The second layer can comprise aluminum or zirconium. In another embodiment, the coating is formed by electroplating a layer comprising a mixture of aluminum and yttrium onto the surface and annealing the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.