Untreated body transfer device and semiconductor manufacturing device with the untreated body transfer device
US7393172B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2000 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Apr 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a wafer transfer system wherein a wafer transfer robot linearly reciprocates by a linear motor, dust is prevented from adhering to a wafer.A fixed base 9, on which the secondary side 11 of a linear motor M for linearly reciprocating a wafer transfer robot R is mounted, is mounted on the system body 1 of a wafer transfer system A in lateral directions and in vertical directions, so that dust dropping in accordance with the flow of clean air K from a clean air supply system 4 is directly sucked into an exhaust fan 5, which is provided on the bottom portion 1c of the system body 1, to be exhausted without being deposited on the top face of the fixed base 9 and the secondary side 11.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.