Integrated circuit package system with heat sink
US7400049B2 · kind B2 · utility
27Cited by
18References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2006 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Feb 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.