Pad characterization tool
US7407433B2 · kind B2 · utility
0Cited by
22References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2006 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Nov 2, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored in-situ. The characterization tool and the polishing pad can be rotated or moved so that any portion of the polishing pad can be tested.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.