Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7422635B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2003 |
| Grant date | Sep 9, 2008 |
| Priority date | — |
| Expiry date | Apr 13, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4583
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method of depositing a reaction product on each of a batch of workpieces positioned in a process chamber in a spaced-apart relationship. A first gas may be delivered to an elongate first delivery conduit that includes a plurality of outlets spaced along a length of the conduit. A first gas flow may be directed by the outlets to flow into at least one of the process spaces between adjacent workpieces along a first vector that is transverse to the direction in which the workpieces are spaced. A second gas may be delivered to an elongate second delivery conduit that also has outlets spaced along its length. A second gas flow of the second gas may be directed by the outlets to flow into the process spaces along a second vector that is transverse to the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.