Method and apparatus for electroprocessing a substrate with edge profile control
US7422982B2 · kind B2 · utility
1Cited by
87References
11Claims
0Family size
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Key dates
| Filing date | Jul 7, 2006 |
| Grant date | Sep 9, 2008 |
| Priority date | — |
| Expiry date | Jul 7, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.