Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beam
US7425716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2006 |
| Grant date | Sep 16, 2008 |
| Priority date | — |
| Expiry date | Dec 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0041
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments in accordance with the present invention relate to a number of techniques, which may be applied alone or in combination, to reduce charge damage of substrates exposed to electron beam radiation. In one embodiment, charge damage is reduced by establishing a robust electrical connection between the exposed substrate and ground. In another embodiment, charge damage is reduced by modifying the sequence of steps for activating and deactivating the electron beam source to reduce the accumulation of charge on the substrate. In still another embodiment, a plasma is struck in the chamber containing the e-beam treated substrate, thereby removing accumulated charge from the substrate. In a further embodiment of the present invention, the voltage of the anode of the e-beam source is reduced in magnitude to account for differences in electron conversion efficiency exhibited by different cathode materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.