System for electropolishing and electrochemical mechanical polishing
US7427337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2004 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Jan 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.