Flexible carrier and release method for high volume electronic package fabrication
US7442581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2004 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Oct 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus are provided for use in manufacturing a device packaging comprising the steps of: positioning a metal substrate such as spring steel on a magnetic plate so as to expose a surface of the metal substrate; placing a first tape layer on the exposed surface of a metal substrate so as to expose a nonstick surface of the first tape layer such as PTFE; placing a second tape layer on the exposed surface of the first tape layer so as to expose a surface of the second tape layer; positioning a mold frame on the exposed surface of the second tape layer; positioning a die within the mold frame; depositing epoxy within the mold frame; curing the epoxy so as to create a molded panel; removing the mold frame; grinding the molded panel to a desired thickness; separating the first tape layer from the second tape layer so as to separate the metal substrate from the molded panel; and peeling the second tape layer from the molded panel. The process provides an efficient method for creating a chips first package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.