Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
US7443019B2 · kind B2 · utility
8Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2006 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Aug 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.