Patent · US Active

System for different bond pads in an integrated circuit package

US7443039B2 · kind B2 · utility

2Cited by

4References

10Claims

0Family size

Assignee

ST ASSEMBLY TEST SERVICES LTD. · SG

Inventors

Lun Zhao · Ballston Lake, US
Wan Lay Looi · Kota Tinggi, MY
Kyaw Oo Aung · Singapore, SG
Yonggang Jin · Singapore, SG
Jae Yong SONG · Daejeon, KR
Won Sun Shin · Seojong-myeon, KR

Key dates

Filing date	Dec 23, 2005
Grant date	Oct 28, 2008
Priority date	—
Expiry date	Jan 15, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.