Patent · US Active

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

US7452568B2 · kind B2 · utility

12Cited by

21References

1Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Gareth G. Hougham · Ossining, US
Leena Paivikki Buchwalter · Hopewell Junction, US
Stephen L. Buchwalter · Hopewell Junction, US
Jon A. Casey · Poughkeepsie, US
Claudius Feger · Rio de Janeiro, BR
Matteo Flotta · Armonk, US
Jeffrey D. Gelorme · Plainville, US
Kathleen C. Hinge · Tarrytown, US
Anurag Jain · Corning, US
Sung Kwon Kang · Chappaqua, US
John U. Knickerbocker · Wappingers Falls, US

Key dates

Filing date	Feb 4, 2005
Grant date	Nov 18, 2008
Priority date	—
Expiry date	Dec 30, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1554
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.