Sensor component with a cavity housing and a sensor chip and method for producing the same

US7464603B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Bauer · Nittendorf, DE
• Angela Kessler · Regensburg, DE
• Wolfgang Schober · Amberg, DE
• Alfred Haimerl · Sinzing, DE
• Joachim Mahler · Regensburg, DE

Key dates

• Filing date: Oct 4, 2007
• Grant date: Dec 16, 2008
• Expiry date: Oct 4, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of the housing and the sensor chip includes a sensor region which faces the opening. The sensor chip is embedded in the cavity of the housing into a rubber-elastic layer with its rear side and its edge sides, where the rubber-elastic layer includes cleavable included organometallic or inorganic metallic complexes. The metals of the complexes lie in a freely accessible manner on the top side of the rubber-elastic layer and form metallic nuclei for wiring lines which electrically connect the sensor region of the sensor chip to contact pads in the cavity of the cavity housing.