Patent · US Active

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

US7470601B2 · kind B2 · utility

2Cited by

2References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Ludwig Heitzer · Regensburg, DE
Eric Kuerzel · Regensburg, DE
Peter Strobel · Regensburg, DE

Key dates

Filing date	Oct 6, 2006
Grant date	Dec 30, 2008
Priority date	—
Expiry date	Oct 20, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.