Mounting a heat sink in thermal contact with an electronic component
US7486516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2005 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Feb 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.