Patent · US Active

Integrated circuit chip packaging assembly

US7488623B2 · kind B2 · utility

0Cited by

2References

4Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Steven Kummerl · Carrollton, US
Anthony L. Coyle · Allen, US
Bernhard Lange · Gerolzhofen, DE

Key dates

Filing date	Jul 9, 2007
Grant date	Feb 10, 2009
Priority date	—
Expiry date	Aug 27, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.