Patent · US Active

Interposer and test assembly for testing electronic devices

US7501839B2 · kind B2 · utility

26Cited by

27References

22Claims

0Family size

Assignee

Endicott Interconnect Technologies, Inc. · US

Inventors

Benson Chan · Vestal, US
Frank D. Egitto · Binghamton, US
Voya R. Markovich · Endwell, US

Key dates

Filing date	Dec 4, 2006
Grant date	Mar 10, 2009
Priority date	—
Expiry date	Dec 4, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10378
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A test apparatus which uses a pair of substrates and housing to interconnect a host substrate (e.g., PCB) to an electronic device (e.g., semiconductor chip) to accomplish testing of the device. The apparatus includes a housing designed for being positioned on the PCB and have one of the substrates oriented therein during device engagement. The engaging contacts of the upper (second) substrate are sculpted to assure effective chip connection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.