Electrochemical method for Ecmp polishing pad conditioning
US7504018B2 · kind B2 · utility
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66References
2Claims
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Key dates
| Filing date | Oct 31, 2006 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Apr 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.