Multi-chip semiconductor connector assemblies
US7508060B2 · kind B2 · utility
1Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2007 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Sep 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one exemplary embodiment, a multi-chip semiconductor connector is utilized for forming a semiconductor package having a plurality of semiconductor die. The multi-chip semiconductor connector is utilized to mechanically attach the plurality of semiconductor die together and to provide electrical connection to the plurality of semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.