Polishing endpoint detection system and method using friction sensor
US7513818B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2004 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Oct 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system, method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.