System for measuring a sample with a layer containing a periodic diffracting structure
US7515253B2 · kind B2 · utility
9Cited by
161References
35Claims
0Family size
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Key dates
| Filing date | Jan 10, 2006 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Jan 13, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/213
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
To measure the critical dimensions and other parameters of a one- or two-dimensional diffracting structure of a film, the calculation may be simplified by first performing a measurement of the thickness of the film, employing a film model that does not vary the critical dimension or parameters related to other characteristics of the structure. The thickness of the film may be estimated using the film model sufficiently accurately so that such estimate may be employed to simplify the structure model for deriving the critical dimension and other parameters related to the two-dimensional diffracting structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.