Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

US7517722B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Bernd Goller · Otterfing, DE
• Robert-Christian Hagen · Sarching, DE
• Gerald Ofner · Regensburg, DE
• Christian Stuempfl · Schmidgaden, DE
• Stefan Wein · Regensburg, DE
• Holger Wörner · Regensburg, DE

Key dates

• Filing date: Jul 24, 2006
• Grant date: Apr 14, 2009
• Expiry date: Feb 21, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.