Microelectronic devices and methods for forming interconnects in microelectronic devices
US7531453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2008 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Feb 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.