LED with substrate modifications for enhanced light extraction and method of making same
US7534633B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2005 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Mar 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
Abstract
The surface morphology of an LED light emitting surface is changed by applying a reactive ion etch (RIE) process to the light emitting surface. Etched features, such as truncated pyramids, may be formed on the emitting surface, prior to the RIE process, by cutting into the surface using a saw blade or a masked etching technique. Sidewall cuts may also be made in the emitting surface prior to the RIE process. A light absorbing damaged layer of material associated with saw cutting is removed by the RIE process. The surface morphology created by the RIE process may be emulated using different, various combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.