Methods for discretized processing of regions of a substrate
US7544574B2 · kind B2 · utility
24Cited by
55References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2006 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Dec 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of new materials, processes, and process sequence integration schemes used in integrated circuit fabrication. A substrate having an array of differentially processed regions thereon is processed by delivering materials to or modifying regions of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.