Integrated circuit including logic portion and memory portion
US7545019B2 · kind B2 · utility
6Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2007 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Aug 7, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/91
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a logic portion including M conductive layers, a memory portion including N conductive layers, and at least one common top conductive layer over the logic portion and the memory portion. M is greater than N.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.