Two-stage die-bonding method for simultaneous die-bonding of multiple dies
US7547575B2 · kind B2 · utility
4Cited by
0References
6Claims
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Assignee
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Key dates
| Filing date | Oct 4, 2007 |
| Grant date | Jun 16, 2009 |
| Priority date | — |
| Expiry date | Oct 4, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.