Chian-Chi Lin
14Patents
8h-index
22Co-inventors
64Inventor score
Filing activity: Dec 30, 2003 → Nov 10, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7002805B2 | Thermal enhance MCM package and manufacturing method thereof | Electricity | 92 | Expired |
| US7741152B2 | Three-dimensional package and method of making the same | Electricity | 36 | Active |
| US7045391B2 | Multi-chips bumpless assembly package and manufacturing method thereof | Electricity | 29 | Expired |
| US7528053B2 | Three-dimensional package and method of making the same | Electricity | 27 | Active |
| US7642132B2 | Three-dimensional package and method of making the same | Electricity | 23 | Active |
| US7446404B2 | Three-dimensional package and method of making the same | Electricity | 13 | Active |
| US7790505B2 | Semiconductor chip package manufacturing method and structure thereof | Electricity | 9 | Active |
| US8288853B2 | Three-dimensional package and method of making the same | Electricity | 8 | Active |
| US7221041B2 | Multi-chips module package and manufacturing method thereof | Electricity | 7 | Expired |
| US7547575B2 | Two-stage die-bonding method for simultaneous die-bonding of multiple dies | Emerging Cross-Sectional Technologies | 4 | Active |
| US7223683B2 | Wafer level bumping process | Electricity | 4 | Expired |
| US7445944B2 | Packaging substrate and manufacturing method thereof | Electricity | 3 | Active |
| US7945062B2 | Microelectromechanical microphone packaging system | Electricity | 1 | Active |
| US7581666B2 | Wire-bonding method for wire-bonding apparatus | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.