Patent · US Active

Method for coating a structure comprising semiconductor chips

US7547645B2 · kind B2 · utility

1Cited by

8References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Ludwig Heitzer · Regensburg, DE
Jens Pohl · San Luis Obispo, US
Peter Strobel · Regensburg, DE
Christian Stuempfl · Schmidgaden, DE

Key dates

Filing date	Aug 16, 2006
Grant date	Jun 16, 2009
Priority date	—
Expiry date	Feb 24, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.