Image sensor module with air escape hole and a method for manufacturing the same
US7554599B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jul 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.