Compressible films surrounding solder connectors
US7566649B2 · kind B2 · utility
4Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2007 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Sep 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.