Dynamic metrology sampling with wafer uniformity control
US7567700B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 28, 2006 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Feb 26, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70525
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of processing a wafer is presented that includes creating a pre-processing measurement map using measured metrology data for the wafer including metrology data for at least one isolated structure on the wafer, metrology data for at least one nested structure on the wafer, or mask data. At least one pre-processing prediction map is calculated for the wafer. A pre-processing confidence map is calculated for the wafer. The pre-processing confidence map includes a set of confidence data for the plurality of dies on the wafer. A prioritized measurement site is determined when the confidence data for one or more dies is not within the confidence limits. A new measurement recipe that includes the prioritized measurement site is then created.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.