Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same
US7573124B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2007 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Jul 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor packaging structure having electromagnetic shielding function is disclosed, in which the packaging structure includes a carrier and a semiconductor substrate disposed thereon. The semiconductor substrate has a patterned passivation layer and a patterned metal layer disposed thereon, in which the patterned metal layer is electrically connected to at least a grounding pad of the carrier via a wire, whereby possessing the semiconductor packaging structure to have electromagnetic shielding function. A method for manufacturing a semiconductor packaging structure having electromagnetic shielding function is also disclosed in the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.