Substrate processing apparatus and substrate processing method
US7575636B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Jun 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.