Wire-bonding method for wire-bonding apparatus
US7581666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Mar 5, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/904
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.