Wafer manufacturing method, polishing apparatus, and wafer
US7582221B2 · kind B2 · utility
28Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2001 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Oct 22, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof that is strongly required recently, and a wafer. In a polishing process for making a mirror surface of the wafer, a back surface of the wafer is polished to produce a reference plane thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.