Process and composition for conductive material removal by electrochemical mechanical polishing

US7582564B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Zhihong Wang · Singapore, SG
• You Wang · Cupertino, US
• Daxin Mao · Cupertino, US
• Renhe Jia · Naperville, US
• Stan Tsai · Clifton Park, US
• Yongqi Hu · Campbell, US
• Yuan Tian · Alameda, US
• Liang-Yuh Chen · San Jose, US

Key dates

• Filing date: May 5, 2005
• Grant date: Sep 1, 2009
• Expiry date: May 29, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/7684
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.