Patent · US Active

Lead structure for a semiconductor component and method for producing the same

US7589403B2 · kind B2 · utility

3Cited by

2References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Angela Kessler · Regensburg, DE
Wolfgang Schober · Amberg, DE
Alfred Haimerl · Sinzing, DE
Joachim Mahler · Regensburg, DE

Key dates

Filing date	Oct 29, 2007
Grant date	Sep 15, 2009
Priority date	—
Expiry date	Nov 28, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S977/938
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.