Patent · US Active

Method for applying a structure of joining material to the back surfaces of semiconductor chips

US7592236B2 · kind B2 · utility

0Cited by

9References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Ludwig Heitzer · Regensburg, DE
Jens Pohl · San Luis Obispo, US
Peter Strobel · Regensburg, DE
Christian Stuempfl · Schmidgaden, DE

Key dates

Filing date	Oct 18, 2006
Grant date	Sep 22, 2009
Priority date	—
Expiry date	Feb 20, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.