Patent · US Active

Processing thin wafers

US7611322B2 · kind B2 · utility

9Cited by
4References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 31, 2005
Grant dateNov 3, 2009
Priority date—
Expiry dateJun 5, 2027

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S414/141
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.