Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

US7629660B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Bauer · Nittendorf, DE
• Alfred Haimerl · Sinzing, DE
• Angela Kessler · Regensburg, DE
• Joachim Mahler · Regensburg, DE
• Wolfgang Schober · Amberg, DE

Key dates

• Filing date: Jun 2, 2006
• Grant date: Dec 8, 2009
• Expiry date: Aug 19, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which itself includes a transparent plastic material. The sensor chip has an active top side and a back side, wherein a sensor area is arranged on the active top side and flipchip contacts are provided outside of the sensor area on the active top side. These flipchip contacts are electrically connected to a circuit structure, wherein the circuit structure allows free access to the sensor area. The sensor chip including the sensor area and the flipchip contacts and a part of the circuit structure which is electrically connected to the flipchip contacts are embedded in the transparent plastic material, wherein the transparent plastic material includes a rubber-elastic substance.