Patent · US Active

Method of separating a mold from a solidified layer disposed on a substrate

US7635445B2 · kind B2 · utility

23Cited by

24References

15Claims

0Family size

Assignee

Molecular Imprints, Inc. · US

Inventors

Byung-Jin Choi · Round Rock, US
Anshuman Cherala · Austin, US
Yeong-Jun Choi · Cedar Park, US
Mario Johannes Meissl · Austin, US
Sidlgata V. Sreenivasan · Austin, US
Norman E. Schumaker · Austin, US
Xiaoming Lu · Cedar Park, US
Ian McMackin · Austin, US
Daniel Babbs · Austin, US

Key dates

Filing date	Apr 18, 2005
Grant date	Dec 22, 2009
Priority date	—
Expiry date	Nov 28, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S977/887
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

The present invention is directed towards a method of separating a mold, included in a template, from a layer disposed on a substrate, the method including, inter alia, applying a separation force to the template to separate the template from the layer; and facilitating localized deformation in the substrate to reduce the separation force required to achieve separation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.