Methods for manufacturing imprinted substrates
US7637008B2 · kind B2 · utility
1Cited by
26References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2002 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Apr 15, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package includes at least one electronic component mounted on an imprinted substrate. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Such features may be formed by imprinting in one operation rather than sequentially. Conductor features, such as trenches, holes, and planes, may be formed of different sizes simultaneously. One or more vias may be formed in one or more trenches. Methods of fabricating an imprinted substrate, as well as application of the imprinted package to an electronic assembly, are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.